Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page x
... Volume 439— Microstructure Evolution During Irradiation , I.M. Robertson , G.S. Was , L.W. Hobbs , T. Diaz de la Rubia , 1997 , ISBN : 1-55899-343-6 Volume 440- Structure and Evolution of Surfaces , R.C. Cammarata , E.H. Chason , T.L. ...
... Volume 439— Microstructure Evolution During Irradiation , I.M. Robertson , G.S. Was , L.W. Hobbs , T. Diaz de la Rubia , 1997 , ISBN : 1-55899-343-6 Volume 440- Structure and Evolution of Surfaces , R.C. Cammarata , E.H. Chason , T.L. ...
Page xi
... Volume 461- Morphological Control in Multiphase Polymer Mixtures , R.M. Briber , C.C. Han , D.G. Peiffer , 1997 , ISBN : 1-55899-365-7 Volume 462- Materials Issues in Art and Archaeology V , P.B. Vandiver , J.R. Druzik , J.F. Merkel , J ...
... Volume 461- Morphological Control in Multiphase Polymer Mixtures , R.M. Briber , C.C. Han , D.G. Peiffer , 1997 , ISBN : 1-55899-365-7 Volume 462- Materials Issues in Art and Archaeology V , P.B. Vandiver , J.R. Druzik , J.F. Merkel , J ...
Page 93
... volume fraction of the various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these would ...
... volume fraction of the various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these would ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch