Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 4
Page 124
... ( TC ) 1.67 3.0 42 Bake / E - Beam Low Dose ( EB - LD ) 1.77 5.7 40 Bake / E ... a small broad absorption at 3500 cm1 . This absorption suggests the presence ... ( a ) 0.40 0.38 ( 124.
... ( TC ) 1.67 3.0 42 Bake / E - Beam Low Dose ( EB - LD ) 1.77 5.7 40 Bake / E ... a small broad absorption at 3500 cm1 . This absorption suggests the presence ... ( a ) 0.40 0.38 ( 124.
Page 125
... TC / EB - LD 0.18 0.16- 0.10 0.14 0.14 0.12 0.12 0.10 EB - LD 0.10 0.08 0.08 ... ( a ) : thermal cure and low dose e - beam cured films ; and ( b ) : thermal ... A significant increase in the film thickness was found for the thermally ...
... TC / EB - LD 0.18 0.16- 0.10 0.14 0.14 0.12 0.12 0.10 EB - LD 0.10 0.08 0.08 ... ( a ) : thermal cure and low dose e - beam cured films ; and ( b ) : thermal ... A significant increase in the film thickness was found for the thermally ...
Page 127
... the same as those for the thermally- cured films , irrespective of the e - beam curing conditions . Table 3 : Dielectric Constants Measured using a MOS Capacitor Structure at 1 MHz . Process Conditions TC EB - LD EB - HD TC / EB - LD TC ...
... the same as those for the thermally- cured films , irrespective of the e - beam curing conditions . Table 3 : Dielectric Constants Measured using a MOS Capacitor Structure at 1 MHz . Process Conditions TC EB - LD EB - HD TC / EB - LD TC ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch