Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 55
Page 4
... adhesion promoter . To obtain sufficient adhesion to many materials , an adhesion promoter must first be coated onto the substrate , resulting in additional processing steps . During processing polyamic precursors are spin - coated onto ...
... adhesion promoter . To obtain sufficient adhesion to many materials , an adhesion promoter must first be coated onto the substrate , resulting in additional processing steps . During processing polyamic precursors are spin - coated onto ...
Page 6
... adhesion promoter and in the absence of any metal adhesion layers . In addition to improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the ...
... adhesion promoter and in the absence of any metal adhesion layers . In addition to improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the ...
Page 82
Adhesion strength ( N ) 0 Cu / Pl evacuating the chamber to base pressure , the metal films were deposited from Cu ... Adhesion Figure 1 shows the adhesion strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi ...
Adhesion strength ( N ) 0 Cu / Pl evacuating the chamber to base pressure , the metal films were deposited from Cu ... Adhesion Figure 1 shows the adhesion strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch