Low-Dielectric Constant Materials III:C. Case, T. Kikkawa, P. Kohl, W. W. Lee Continuing improvement of integrated circuits (ICs) critically depends on the use of nonconventional materials. Interconnect delay is already the most severe limiting factor in most advanced IC. This delay can be minimized by reducing the interconnect capacitance, which is determined by a combination of process architecture and materials. While a broad range of candidate materials is being explored for IC application, there is no clear consensus on what material will be used to replace SiO2. Process architectures are also unsettled, with various efforts directed to either evolving present-day technology or switching to a damascene metal approach. Yet these processes may not be scaleable beyond the 0.15 µm generation of IC technology. This book brings together experts in the field of low-k dielectrics to focus on the challenges ahead. Topics include: organic and inorganic dielectrics; interfaces and porous materials; measurement and characterization; vapor-deposited materials; fluorinated oxides and polyimides. |
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Page 4
The processing of polyimides typically requires the use of adhesion promoter. To
obtain sufficient adhesion to many materials, an adhesion promoter must first be
coated onto the substrate, resulting in additional processing steps. During ...
The processing of polyimides typically requires the use of adhesion promoter. To
obtain sufficient adhesion to many materials, an adhesion promoter must first be
coated onto the substrate, resulting in additional processing steps. During ...
Page 6
provided excellent adhesion of the film to aluminum and oxidized silicon. The
functionalized polymer also adhered to gold, copper, and silver without the use of
adhesion promoter and in the absence of any metal adhesion layers. In addition
to ...
provided excellent adhesion of the film to aluminum and oxidized silicon. The
functionalized polymer also adhered to gold, copper, and silver without the use of
adhesion promoter and in the absence of any metal adhesion layers. In addition
to ...
Page 82
The adhesion strength of CuTi films on PI was increased by post-deposition
annealing (except Ar plasma pre-treatment), while no remarkable increase was
noticed for Cu/PI system. Further improvement was achieved by 02/Ar plasma (
abbr.
The adhesion strength of CuTi films on PI was increased by post-deposition
annealing (except Ar plasma pre-treatment), while no remarkable increase was
noticed for Cu/PI system. Further improvement was achieved by 02/Ar plasma (
abbr.
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Contents
Polynorbornene for Lowk Interconnection | 3 |
SiLK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
33 other sections not shown
Other editions - View all
Low-Dielectric Constant Materials II: H. Treichel,A. C. Jones,A. Lagendijk,K. Uram Snippet view - 1997 |
Common terms and phrases
1997 Materials Research adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical CMP process coating copolymers cured films curve decrease delamination density device dielectric constant dielectric material diffusion e-beam cured electron Figure film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N passivation peak PECVD permittivity planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si SiF4 silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch
Bibliographic information
| Title | Low-Dielectric Constant Materials III: Materials Research Society Symposia Proceedings, Materials Research Society Symposia Proceedings |
| Editors | C. Case, T. Kikkawa, P. Kohl, W. W. Lee |
| Publisher | Materials Research Society, 1998 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| Length | 300 pages |
| Subjects | › Technology & Engineering / Materials Science Technology & Engineering / Superconductors & Superconductivity |
| Export Citation | BiBTeX EndNote RefMan |