Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 5
... aluminum , silver , gold , and copper and pass the tape test even after being placed in boiling water for two hours . R Figure 1. Generic polynorbornene structure Although properties such as Tg and low moisture absorption are inherent ...
... aluminum , silver , gold , and copper and pass the tape test even after being placed in boiling water for two hours . R Figure 1. Generic polynorbornene structure Although properties such as Tg and low moisture absorption are inherent ...
Page 61
... aluminum oxide . For these reasons , aluminum oxide might form a thermodynamic " sink " for migrating metal fluorides : ( 1 ) Al - F + AlOx → F - AlOx + Al Thin alumina films on fluoropolymer surfaces are therefore of potential ...
... aluminum oxide . For these reasons , aluminum oxide might form a thermodynamic " sink " for migrating metal fluorides : ( 1 ) Al - F + AlOx → F - AlOx + Al Thin alumina films on fluoropolymer surfaces are therefore of potential ...
Page 75
... aluminum under different thermal treatment conditions have been investigated using transmission electron microscopy ( TEM ) and x - ray diffractometry ( XRD ) techniques over a wide temperature range . Our results suggest that the ...
... aluminum under different thermal treatment conditions have been investigated using transmission electron microscopy ( TEM ) and x - ray diffractometry ( XRD ) techniques over a wide temperature range . Our results suggest that the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch