Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 35
Page 107
... analysis which compares cured and uncured films are presented as Figure 1. For the uncured film ( the upper curve ) , absorption due to hydroxyl groups are evident in peaks at 3400 cm1 and at approximately 1000 cm1 . An FTIR scan taken ...
... analysis which compares cured and uncured films are presented as Figure 1. For the uncured film ( the upper curve ) , absorption due to hydroxyl groups are evident in peaks at 3400 cm1 and at approximately 1000 cm1 . An FTIR scan taken ...
Page 257
... analysis . Figure 2 shows the thermogram of cured polyimide samples . According to the TGA analysis , the onset thermal decomposition temperature is determined to be 520 ° C . The onset glass transition temperature ( Tg ) , determined ...
... analysis . Figure 2 shows the thermogram of cured polyimide samples . According to the TGA analysis , the onset thermal decomposition temperature is determined to be 520 ° C . The onset glass transition temperature ( Tg ) , determined ...
Page 263
... analysis showed high F con- centration at the interface in the Ti films . The F profiles do not suggest a simple F diffusion into the Ti films . min anneal , optical inspection showed no bubbling or film blistering on the unpatterned ...
... analysis showed high F con- centration at the interface in the Ti films . The F profiles do not suggest a simple F diffusion into the Ti films . min anneal , optical inspection showed no bubbling or film blistering on the unpatterned ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch