Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 18
Page 129
... anisotropy in dielectric constant , where the smaller out - of - plane dielectric constant , typically measured using parallel - plate capacitors , can misleadingly exaggerate the advantage in reducing crosstalk . In this paper , we ...
... anisotropy in dielectric constant , where the smaller out - of - plane dielectric constant , typically measured using parallel - plate capacitors , can misleadingly exaggerate the advantage in reducing crosstalk . In this paper , we ...
Page 145
... anisotropy in the rod - like polymer film is estimated to be much larger than the measured Aɛ . This result is ... anisotropy of a rigid rod - like polymer confined in a submicron trench is reduced relative to the anisotropy in a blanket ...
... anisotropy in the rod - like polymer film is estimated to be much larger than the measured Aɛ . This result is ... anisotropy of a rigid rod - like polymer confined in a submicron trench is reduced relative to the anisotropy in a blanket ...
Page 259
... anisotropy can be characterized by birefringence defined as the difference between the in - plane and out - of - plane indices [ 14 ] . Five samples of various thicknesses ( 1 - 5 μm ) were prepared for the ATR measurement . The average ...
... anisotropy can be characterized by birefringence defined as the difference between the in - plane and out - of - plane indices [ 14 ] . Five samples of various thicknesses ( 1 - 5 μm ) were prepared for the ATR measurement . The average ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch