Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 113
... applications . In general , polyimides satisfy the demands of these applications because of their robust thermomechanical properties , thermal stability for metalization - related processes and chemical resistance to aggressive wet etch ...
... applications . In general , polyimides satisfy the demands of these applications because of their robust thermomechanical properties , thermal stability for metalization - related processes and chemical resistance to aggressive wet etch ...
Page 219
... applications . All films were deposited in a prototype production system that included a vacuum chamber , electrostatic cold chuck and a parylene vapor delivery system . Chuck temperatures as low as -30 ° C were achieved . The ...
... applications . All films were deposited in a prototype production system that included a vacuum chamber , electrostatic cold chuck and a parylene vapor delivery system . Chuck temperatures as low as -30 ° C were achieved . The ...
Page 254
... Applications in Microelectronics , edited by T. M. Lu , S. P. Murarka , T. S. Kuan and C. H. Ting ( Mater . Res . Soc . Proc . 381 , Pittsburg , PA , 1995 ) , p.9 . 2. C. Feger and H. Franke , in Polyimides , Fundamentals and Applications ...
... Applications in Microelectronics , edited by T. M. Lu , S. P. Murarka , T. S. Kuan and C. H. Ting ( Mater . Res . Soc . Proc . 381 , Pittsburg , PA , 1995 ) , p.9 . 2. C. Feger and H. Franke , in Polyimides , Fundamentals and Applications ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch