Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 57
Page 85
... As deposited After annealed As - deposited films had rather high resistivities of about 89 μ cm . The post - deposition annealing decreased the resistivity by about 40 - 50 % . Many factors , like grain structures , relaxation , solute ...
... As deposited After annealed As - deposited films had rather high resistivities of about 89 μ cm . The post - deposition annealing decreased the resistivity by about 40 - 50 % . Many factors , like grain structures , relaxation , solute ...
Page 161
... as - deposited film or post - deposition treated film , and polishing time . The quality of the films has been investigated by using X - ray photoelectron spectroscopy ( XPS ) and atomic force microscopy ( AFM ) . It is shown that the ...
... as - deposited film or post - deposition treated film , and polishing time . The quality of the films has been investigated by using X - ray photoelectron spectroscopy ( XPS ) and atomic force microscopy ( AFM ) . It is shown that the ...
Page 280
... as - deposited " samples and samples that had been etched in 100 : 1 H2O : HF solution . For each condition , as - deposited and etched samples were taken from adjacent die near the center of the same wafer . As - deposited samples were ...
... as - deposited " samples and samples that had been etched in 100 : 1 H2O : HF solution . For each condition , as - deposited and etched samples were taken from adjacent die near the center of the same wafer . As - deposited samples were ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch