Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 40
... bonds to silica results in densification of hydrogen silsesquioxane and increased dielectric constant , it is not the only contribution to dielectric constant deterioration in the data reported in figure 4b . Polar bonds strongly ...
... bonds to silica results in densification of hydrogen silsesquioxane and increased dielectric constant , it is not the only contribution to dielectric constant deterioration in the data reported in figure 4b . Polar bonds strongly ...
Page 273
... bond - stretching and -bending infrared bands accounting for a significant fraction of the reduction in the dielectric ... bonds produce decreases in the integrated IR absorptions of the vibrational modes of the nearest neighbor Si - O ...
... bond - stretching and -bending infrared bands accounting for a significant fraction of the reduction in the dielectric ... bonds produce decreases in the integrated IR absorptions of the vibrational modes of the nearest neighbor Si - O ...
Page 274
... bonds / Si atom ( Nsi - 0 ) is equal to ( 6-2x ) / ( 2 - x ) , and the number of Si - F bonds / Si atom ( Nsi - F ) is equal to ( 2-2x ) / ( 2 - x ) . Figure 1 ( a ) contains Nsi - o and Nsi - F and Fig . 1 ( b ) contains the atomic ...
... bonds / Si atom ( Nsi - 0 ) is equal to ( 6-2x ) / ( 2 - x ) , and the number of Si - F bonds / Si atom ( Nsi - F ) is equal to ( 2-2x ) / ( 2 - x ) . Figure 1 ( a ) contains Nsi - o and Nsi - F and Fig . 1 ( b ) contains the atomic ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch