Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 12
Page 99
... bulk aerogel spheres at 22GHz microwave frequency , using a cavity perturbation method . The results of the dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano ...
... bulk aerogel spheres at 22GHz microwave frequency , using a cavity perturbation method . The results of the dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano ...
Page 161
... bulk leakage , and low stress [ 12 ] . For future multilevel interconnect technology , global planarization by CMP is highly desirable . However , polymers are soft and chemically inert to ordinary acids and bases , and these require ...
... bulk leakage , and low stress [ 12 ] . For future multilevel interconnect technology , global planarization by CMP is highly desirable . However , polymers are soft and chemically inert to ordinary acids and bases , and these require ...
Page 258
... bulk properties . Bulk properties can be measured using a standard Vickers tester . However , even the lightest loads used in the tester may cause interactions with the underlying substrate or puncture through the film . Nano ...
... bulk properties . Bulk properties can be measured using a standard Vickers tester . However , even the lightest loads used in the tester may cause interactions with the underlying substrate or puncture through the film . Nano ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch