Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 138
... calculated . The room temperature TEC's of Si and GaAs are 2.6 and 5.7 ppm / ° C , respectively . Microtensile Test Apparatus Free standing film stress - stain measurements are collected at ambient conditions using a homebuilt ...
... calculated . The room temperature TEC's of Si and GaAs are 2.6 and 5.7 ppm / ° C , respectively . Microtensile Test Apparatus Free standing film stress - stain measurements are collected at ambient conditions using a homebuilt ...
Page 141
... calculation of a lower limit , E > 6 GPa . The stress - strain curve of this brittle FPI film was also acquired by ... calculated from the initial linear slope . Cracking and delamination of the FPI film during testing is a concern if ...
... calculation of a lower limit , E > 6 GPa . The stress - strain curve of this brittle FPI film was also acquired by ... calculated from the initial linear slope . Cracking and delamination of the FPI film during testing is a concern if ...
Page 277
geometries calculated , the SCF solution was found to be the dominant configuration . Configurations with coefficients greater than 0.05 are included as parent configurations . Details of the procedure are found in Refs . 9-12 . Figures ...
geometries calculated , the SCF solution was found to be the dominant configuration . Configurations with coefficients greater than 0.05 are included as parent configurations . Details of the procedure are found in Refs . 9-12 . Figures ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch