Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 118
... Capacitance ( pF ) Capacitance Shift ( pF ) ε 2.03 4.56 5.56 2.93 ( line - to - line ) 2.77 +/- 0.18 8.84 6.36 4.35 +/- 0.13 The capacitance shift parameter in Table III refers to the difference in capacitance before ( i.e. line - to ...
... Capacitance ( pF ) Capacitance Shift ( pF ) ε 2.03 4.56 5.56 2.93 ( line - to - line ) 2.77 +/- 0.18 8.84 6.36 4.35 +/- 0.13 The capacitance shift parameter in Table III refers to the difference in capacitance before ( i.e. line - to ...
Page 139
... capacitance is measure using a HP4192A Impedance Analyzer at 1 MHz . The dielectric constant is calculated from the capacitance using ɛ = Ct / ε A where C is the capacitance , t the dielectric thickness , & is the permittivity in free ...
... capacitance is measure using a HP4192A Impedance Analyzer at 1 MHz . The dielectric constant is calculated from the capacitance using ɛ = Ct / ε A where C is the capacitance , t the dielectric thickness , & is the permittivity in free ...
Page 143
... capacitance between the lines including the fringe capacitance is determined . The in - plane dielectric constant is extracted by comparing the experimentally measured total capacitance to that simulated . The simulation requires the ...
... capacitance between the lines including the fringe capacitance is determined . The in - plane dielectric constant is extracted by comparing the experimentally measured total capacitance to that simulated . The simulation requires the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch