Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 32
... capacitor consisting of two conductive plates and the material of interest as the dielectric . To make the capacitor ... capacitors . The advantage of this type of device is that it is not susceptible to changes in the semiconductor ...
... capacitor consisting of two conductive plates and the material of interest as the dielectric . To make the capacitor ... capacitors . The advantage of this type of device is that it is not susceptible to changes in the semiconductor ...
Page 147
... capacitor industry in the last decade , replacing polychlorinated solvent swelled Kraft paper as the dielectric material of choice for certain high - energy- density capacitors.4,5,6 Prior to use , these films are biaxially drawn on ...
... capacitor industry in the last decade , replacing polychlorinated solvent swelled Kraft paper as the dielectric material of choice for certain high - energy- density capacitors.4,5,6 Prior to use , these films are biaxially drawn on ...
Page 152
... capacitor industry . The orthotropic film has large differences in its out - of - plane modulus and thermal expansion ... Capacitors and Dielectric Materials , ( National Academy Press , Washington D. C. , 13-48 , 1981 ) . 7. T. Ariyama ...
... capacitor industry . The orthotropic film has large differences in its out - of - plane modulus and thermal expansion ... Capacitors and Dielectric Materials , ( National Academy Press , Washington D. C. , 13-48 , 1981 ) . 7. T. Ariyama ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch