Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 45
... chamber on Allied Signal's SOG ( spin - on - glass ) T11 and low к SOP ( spin - on - polymer ) 418 together with liner films of PE - oxide and oxynitride for IMD ( inter - metal dielectric ) planarization . Excellent chamber performance ...
... chamber on Allied Signal's SOG ( spin - on - glass ) T11 and low к SOP ( spin - on - polymer ) 418 together with liner films of PE - oxide and oxynitride for IMD ( inter - metal dielectric ) planarization . Excellent chamber performance ...
Page 62
... chamber ( base pressure 8 x 1010 Torr after bakeout ) , and a turbomolecularly pumped processing chamber ( base pressure 1 x 108 Torr ) . The analytical chamber was equipped with an unmonochromatized dual anode x - ray source and ...
... chamber ( base pressure 8 x 1010 Torr after bakeout ) , and a turbomolecularly pumped processing chamber ( base pressure 1 x 108 Torr ) . The analytical chamber was equipped with an unmonochromatized dual anode x - ray source and ...
Page 69
... chamber and a reaction chamber which were pumped by a turbo molecule pump and a dry pump . Microwave ( 2.45GHz ) was supplied from microwave window into the plasma chamber . The wafer was chucked on ESC ( Electrostatic Chuck ) which was ...
... chamber and a reaction chamber which were pumped by a turbo molecule pump and a dry pump . Microwave ( 2.45GHz ) was supplied from microwave window into the plasma chamber . The wafer was chucked on ESC ( Electrostatic Chuck ) which was ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch