Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 9
... characteristics of SILK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm . The glass transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal ...
... characteristics of SILK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm . The glass transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal ...
Page 45
... characteristics of flowable nature [ 1 ] . Thin CVD films ( PE - oxide or oxynitride ) are usually deposited onto metal lines as a moisture barrier followed by SOG coating . SOG etchback planarization requires chamber hardware and a ...
... characteristics of flowable nature [ 1 ] . Thin CVD films ( PE - oxide or oxynitride ) are usually deposited onto metal lines as a moisture barrier followed by SOG coating . SOG etchback planarization requires chamber hardware and a ...
Page 93
... characteristics of a number of polyimide foams is shown in Table 2 . Table 2. Characteristics of Polyimide Foams . Sample Entry PMDA / 3FDA Polyimide 2 3 5 6 7 Initial Labile Block Composition , Vol . % Density ( g / cm3 ) Volume ...
... characteristics of a number of polyimide foams is shown in Table 2 . Table 2. Characteristics of Polyimide Foams . Sample Entry PMDA / 3FDA Polyimide 2 3 5 6 7 Initial Labile Block Composition , Vol . % Density ( g / cm3 ) Volume ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch