Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 9
... Chemical Company , M. E. Pruitt Research Center , 1712 Building , Midland , MI 48674 ABSTRACT A novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits . The ...
... Chemical Company , M. E. Pruitt Research Center , 1712 Building , Midland , MI 48674 ABSTRACT A novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits . The ...
Page 161
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ** Center for ...
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ** Center for ...
Page 169
... chemical structures . PA - N is a linear crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3. The VDP gas monomer is p - xylylene . The weakest bond in PA - N is the C - C bond ...
... chemical structures . PA - N is a linear crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3. The VDP gas monomer is p - xylylene . The weakest bond in PA - N is the C - C bond ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch