Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 9
a trademark of The Dow Chemical Company 12 INTRODUCTION Spin - on organic dielectrics offer the possibility for increasing interconnect performance while increasing manufacturing throughput and lowering production costs .
a trademark of The Dow Chemical Company 12 INTRODUCTION Spin - on organic dielectrics offer the possibility for increasing interconnect performance while increasing manufacturing throughput and lowering production costs .
Page 161
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM > > > ** G.-R. Yang * , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ...
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM > > > ** G.-R. Yang * , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ...
Page 169
PA - N and BCB are very different polymers due to their chemical structures . PA - N is a linear crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3.
PA - N and BCB are very different polymers due to their chemical structures . PA - N is a linear crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3.
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Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer