Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page vii
... Chemical Mechanical Polishing of Polymer Films : Comparison of ... VAPOR DEPOSITED MATERIALS * Diagnostics , Mechanisms of Deposition , and ... Chemical Vapor - Deposited Teflon Amorphous Fluoropolymer as an Interlevel Dielectric Material ...
... Chemical Mechanical Polishing of Polymer Films : Comparison of ... VAPOR DEPOSITED MATERIALS * Diagnostics , Mechanisms of Deposition , and ... Chemical Vapor - Deposited Teflon Amorphous Fluoropolymer as an Interlevel Dielectric Material ...
Page 207
... chemical vapor deposition ( CVD ) technique for the deposition of DuPont's Teflon amorphous fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra ...
... chemical vapor deposition ( CVD ) technique for the deposition of DuPont's Teflon amorphous fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra ...
Page 261
... deposited using plasma enhanced chemical vapor deposition ( PECVD ) is one candidate for low k inter - metal dielectric ( IMD ) applications due to its high thermal conductivity , simple deposition method , and low cost . ( 12 ) The FSG ...
... deposited using plasma enhanced chemical vapor deposition ( PECVD ) is one candidate for low k inter - metal dielectric ( IMD ) applications due to its high thermal conductivity , simple deposition method , and low cost . ( 12 ) The FSG ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch