Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 53
... composition and microstructure were not showing significant changes , and resulted coatings with similar dielectric constants . Auger composition profiles provided some information about this hypothesis . However , this shall be ...
... composition and microstructure were not showing significant changes , and resulted coatings with similar dielectric constants . Auger composition profiles provided some information about this hypothesis . However , this shall be ...
Page 163
... composition , the influence of the quality of the as - deposited film and the influence of polishing time on surface characteristics . A. The influence of the slurry The selection of slurries is critical in any CMP process and ...
... composition , the influence of the quality of the as - deposited film and the influence of polishing time on surface characteristics . A. The influence of the slurry The selection of slurries is critical in any CMP process and ...
Page 274
compound composition is Si2O3F2 . Fluorinated oxides with lower concentrations of F can then be described as a homogeneous alloy mixture of SiO2 and Si2O3F2 , where a pseudo - binary alloy notation ( SiO2 ) x ( Si2O3F2 ) 1 - x is then ...
compound composition is Si2O3F2 . Fluorinated oxides with lower concentrations of F can then be described as a homogeneous alloy mixture of SiO2 and Si2O3F2 , where a pseudo - binary alloy notation ( SiO2 ) x ( Si2O3F2 ) 1 - x is then ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch