Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 29
Page 126
... Cooling Phase 60 -0 --- Heating Phase Cooling Phase Stress ( MPa ) 20 20 40 40 Stress ( MPa ) 40 20 20 0 0 bd -20 -20 0 100 200 300 400 500 0 100 200 300 400 500 Temperature ( ° C ) Temperature ( ° C ) Fig . 3 Stress as a function of ...
... Cooling Phase 60 -0 --- Heating Phase Cooling Phase Stress ( MPa ) 20 20 40 40 Stress ( MPa ) 40 20 20 0 0 bd -20 -20 0 100 200 300 400 500 0 100 200 300 400 500 Temperature ( ° C ) Temperature ( ° C ) Fig . 3 Stress as a function of ...
Page 233
... cooling rate for the quenched process was measured to be 700 ° C / sec , the cooling rate for the oven sintered process was measured to be less than 1 ° C / sec . The cooling curves are shown in Figures 1 and 2 . 390 370 Temp . , C 390 ...
... cooling rate for the quenched process was measured to be 700 ° C / sec , the cooling rate for the oven sintered process was measured to be less than 1 ° C / sec . The cooling curves are shown in Figures 1 and 2 . 390 370 Temp . , C 390 ...
Page 259
... cooling curve with the equation , it was found that most of the thermal stresses were relaxed during the cooling process . The extent to which the stress relaxes is influenced by both the polyimide chemistry and the processing ...
... cooling curve with the equation , it was found that most of the thermal stresses were relaxed during the cooling process . The extent to which the stress relaxes is influenced by both the polyimide chemistry and the processing ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch