Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 21
Page 88
... copolymer approach . In these systems the pore sizes are in the nanometer range thus the term " nanofoam " . The ... copolymer morphology ( see Figure 2 ) . It is important that the initial block copolymer morphology is in the Phase ...
... copolymer approach . In these systems the pore sizes are in the nanometer range thus the term " nanofoam " . The ... copolymer morphology ( see Figure 2 ) . It is important that the initial block copolymer morphology is in the Phase ...
Page 91
... copolymer synthesis . The common approach has been to use aminophenyl - terminated labile blocks , which when reacted with in the correct amount with diamines and dianhydrides , will lead to A - B - A block copolymers . A number of ...
... copolymer synthesis . The common approach has been to use aminophenyl - terminated labile blocks , which when reacted with in the correct amount with diamines and dianhydrides , will lead to A - B - A block copolymers . A number of ...
Page 201
... Copolymer thickness was measured prior to dot formation across each wafer with spectral ellipsometry from 300 nm to 850 nm and calculated at each point by a non - linear least squares fit of thickness and the complex refractive index in ...
... Copolymer thickness was measured prior to dot formation across each wafer with spectral ellipsometry from 300 nm to 850 nm and calculated at each point by a non - linear least squares fit of thickness and the complex refractive index in ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch