Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 91
polyimide matrix , be thermally stable during the processing of the copolymer film and must degrade quantitatively ... In the polyimide copolymers we have studied , we require labile blocks that can withstand curing temperatures of ...
polyimide matrix , be thermally stable during the processing of the copolymer film and must degrade quantitatively ... In the polyimide copolymers we have studied , we require labile blocks that can withstand curing temperatures of ...
Page 93
Some characteristics for several block copolymers are shown in Table 1. ' H NMR was used to determine the amount of the thermally labile block actually incorporated into the copolymers . Those values were found to be in good agreement ...
Some characteristics for several block copolymers are shown in Table 1. ' H NMR was used to determine the amount of the thermally labile block actually incorporated into the copolymers . Those values were found to be in good agreement ...
Page 94
The remaining copolymers studied thermally decompose at temperatures between 250 - 375 ° C . Through proper control of the thermal processing temperatures , copolymers containing these blocks can be foamed in an oxygen free atmosphere .
The remaining copolymers studied thermally decompose at temperatures between 250 - 375 ° C . Through proper control of the thermal processing temperatures , copolymers containing these blocks can be foamed in an oxygen free atmosphere .
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Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer