Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 18
Page 35
... cross- linking in the film , which can increase the ring statistics ( leading to larger microvoids ) , and increase ... cross - linking , in that films with as - deposited K ~ 2 ( F : H ~ 3 ) are not thermally stable , when compared to ...
... cross- linking in the film , which can increase the ring statistics ( leading to larger microvoids ) , and increase ... cross - linking , in that films with as - deposited K ~ 2 ( F : H ~ 3 ) are not thermally stable , when compared to ...
Page 52
... cross - linking . Samples were exposed for certain period of time from few minutes to an hour . When cross - linking occurred , the yellow polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was ...
... cross - linking . Samples were exposed for certain period of time from few minutes to an hour . When cross - linking occurred , the yellow polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was ...
Page 205
... crosslinked is of little doubt since it would be almost impossible to obtain such superior performance for both adhesion and thermal stability without it , however , the extent of the crosslinking is unknown and not well answered by the ...
... crosslinked is of little doubt since it would be almost impossible to obtain such superior performance for both adhesion and thermal stability without it , however , the extent of the crosslinking is unknown and not well answered by the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch