Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 104
... Crystalline Sol . 96 , 1159 ( 1987 ) . 3. A.da Silva , P. Donoso and M.A. Aegerter , J. Non - Crystalline Sol . 145 , 168-174 ( 1992 ) . 4. L.W. Hrubesh , L.E. Keene and V.R. Latorre , J. Mater . Res . 8 , 1736-1741 ( 1993 ) . 5. P ...
... Crystalline Sol . 96 , 1159 ( 1987 ) . 3. A.da Silva , P. Donoso and M.A. Aegerter , J. Non - Crystalline Sol . 145 , 168-174 ( 1992 ) . 4. L.W. Hrubesh , L.E. Keene and V.R. Latorre , J. Mater . Res . 8 , 1736-1741 ( 1993 ) . 5. P ...
Page 169
... crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3. The VDP gas monomer is p - xylylene . The weakest bond in PA - N is the C - C bond between the two p - xylylene , i.e. -CH2 ...
... crystalline polymer with high molecular weight . Its VDP formation and chemical structure is shown in Fig . 3. The VDP gas monomer is p - xylylene . The weakest bond in PA - N is the C - C bond between the two p - xylylene , i.e. -CH2 ...
Page 230
... crystalline phase transition temperatures than a control parylene - N film . These observations are consistent with films of lower molecular weight than the control film . X - ray diffraction was used to monitor crystalline changes in ...
... crystalline phase transition temperatures than a control parylene - N film . These observations are consistent with films of lower molecular weight than the control film . X - ray diffraction was used to monitor crystalline changes in ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch