Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 44
Page 107
... cured and uncured films are presented as Figure 1. For the uncured film ( the upper curve ) , absorption due to hydroxyl groups are evident in peaks at 3400 cm1 and at approximately 1000 cm1 . An FTIR scan taken after the film is cured ...
... cured and uncured films are presented as Figure 1. For the uncured film ( the upper curve ) , absorption due to hydroxyl groups are evident in peaks at 3400 cm1 and at approximately 1000 cm1 . An FTIR scan taken after the film is cured ...
Page 121
... cured films after immersion in N - methylpyrrolidone ( NMP ) at 90 ° C for 1 hour . The glass transition temperature ( T ) for films cured with a low e- beam dose is slightly higher than , or nearly the same as , the T , for thermally ...
... cured films after immersion in N - methylpyrrolidone ( NMP ) at 90 ° C for 1 hour . The glass transition temperature ( T ) for films cured with a low e- beam dose is slightly higher than , or nearly the same as , the T , for thermally ...
Page 124
... cured and e - beam cured films are summarized in Table 2. Compared to the thermal cure , the e - beam cure leads to a higher refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase ...
... cured and e - beam cured films are summarized in Table 2. Compared to the thermal cure , the e - beam cure leads to a higher refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch