Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 138
... curve is expressed by k = do dt = ( α , -a , ) M , where the a's are the thermal expansion coefficients , TEC , and ( 2 ) M , = E , 1 - v , ( 3 ) is the biaxial modulus . The subscripts ' s ' and ' f represent the substrate and the film ...
... curve is expressed by k = do dt = ( α , -a , ) M , where the a's are the thermal expansion coefficients , TEC , and ( 2 ) M , = E , 1 - v , ( 3 ) is the biaxial modulus . The subscripts ' s ' and ' f represent the substrate and the film ...
Page 141
... curve , but the FPI film breaks too soon to determine whether it is in the elastic region . However , the curve allowed the calculation of a lower limit , E > 6 GPa . The stress - strain curve of this brittle FPI film was also acquired ...
... curve , but the FPI film breaks too soon to determine whether it is in the elastic region . However , the curve allowed the calculation of a lower limit , E > 6 GPa . The stress - strain curve of this brittle FPI film was also acquired ...
Page 142
... curve is the average of four runs , and the composite curve is the average of 3 runs . Stress ( MPa ) 250 200 150 100 150 T Stress Strain Curve of FPI film 0 Youngs Modulus = 11.19 GPa - 1 0.00 0.02 0.04 0.06 0.08 0.10 0.1 Strain Figure ...
... curve is the average of four runs , and the composite curve is the average of 3 runs . Stress ( MPa ) 250 200 150 100 150 T Stress Strain Curve of FPI film 0 Youngs Modulus = 11.19 GPa - 1 0.00 0.02 0.04 0.06 0.08 0.10 0.1 Strain Figure ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch