Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 227
The bending beam thermal stress measurements show a large hysteresis that
occurs after the first thermal cycle ( first heating and cooling ... No hysteresis is
observed in subsequent thermal cycles which nearly overlay the first cooling
cycle .
The bending beam thermal stress measurements show a large hysteresis that
occurs after the first thermal cycle ( first heating and cooling ... No hysteresis is
observed in subsequent thermal cycles which nearly overlay the first cooling
cycle .
Page 229
First Thermal Cycle Cooling Cycle Stress Inflection Stress ( MPa ) ဝဝဝဝ
0000000008 Heating Cycle - 40 + 0 50 100 150 200 250 300 350 400
Temperature ( °C ) 20 DEBBBB Third Thermal Cycle Cooling Curve Stress
Inflection ...
First Thermal Cycle Cooling Cycle Stress Inflection Stress ( MPa ) ဝဝဝဝ
0000000008 Heating Cycle - 40 + 0 50 100 150 200 250 300 350 400
Temperature ( °C ) 20 DEBBBB Third Thermal Cycle Cooling Curve Stress
Inflection ...
Page 269
500 TT 500 a 1st cycle th2nd cycle a 3rd cycle - - a 1st cycle 2nd cycle 3rd cycle
100 000000000 OR utiouibucion Stress ( MPa ) OSTS Stress ( MPa ) 0 0000000
cocoagu sulla antes Sociodiconos P sono 100 LIL 0 100 200 300 400 500 ...
500 TT 500 a 1st cycle th2nd cycle a 3rd cycle - - a 1st cycle 2nd cycle 3rd cycle
100 000000000 OR utiouibucion Stress ( MPa ) OSTS Stress ( MPa ) 0 0000000
cocoagu sulla antes Sociodiconos P sono 100 LIL 0 100 200 300 400 500 ...
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Contents
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
INTERFACES AND POROUS MATERIALS | 59 |
Copyright | |
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Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode moisture observed obtained occurs oxide oxygen PA-N passivation peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer