Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 227
... cycle ( first heating and cooling curve ) , Figure 5. No hysteresis is observed in subsequent thermal cycles which nearly overlay the first cooling cycle . The first thermal cycle to 350 ° C effectively anneals the film so that ...
... cycle ( first heating and cooling curve ) , Figure 5. No hysteresis is observed in subsequent thermal cycles which nearly overlay the first cooling cycle . The first thermal cycle to 350 ° C effectively anneals the film so that ...
Page 229
... Cycle Stress Inflection 0 -20 -40 0 Heating Cycle A 50 100 150 200 250 300 350 400 Temperature ( ° C ) 20 Third Thermal Cycle Cooling Curve 10 0 Heating Curve Stress Inflection -10 200 250 Stress Inflection 300 B 350 Temperature ( ° C ) ...
... Cycle Stress Inflection 0 -20 -40 0 Heating Cycle A 50 100 150 200 250 300 350 400 Temperature ( ° C ) 20 Third Thermal Cycle Cooling Curve 10 0 Heating Curve Stress Inflection -10 200 250 Stress Inflection 300 B 350 Temperature ( ° C ) ...
Page 269
the firs nclosed 500 1st cycle 500 1st cycle 2nd cycle 2nd cycle 3rd cycle penetra 3rd cycle 400 after s alcula Stress ( MPa ) 400 300 Stress ( MPa ) 300 200 1 ( a ide w 200 are mpedi FC dur average stress 100 0 100 200 300 400 ...
the firs nclosed 500 1st cycle 500 1st cycle 2nd cycle 2nd cycle 3rd cycle penetra 3rd cycle 400 after s alcula Stress ( MPa ) 400 300 Stress ( MPa ) 300 200 1 ( a ide w 200 are mpedi FC dur average stress 100 0 100 200 300 400 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch