Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 117
... delamination of the FPI between metal lines indicating that confinement of FPI and the additional surface area provided by the metal line sidewalls may prevent delamination . The blanket FPI underlayer does not show any delamination at ...
... delamination of the FPI between metal lines indicating that confinement of FPI and the additional surface area provided by the metal line sidewalls may prevent delamination . The blanket FPI underlayer does not show any delamination at ...
Page 265
... delamination . According to the electrical test data , the TiSi2 delamination did not significantly degrade the contact resistance . However , this will become a long term reliability issue . The data discussed above show that both the ...
... delamination . According to the electrical test data , the TiSi2 delamination did not significantly degrade the contact resistance . However , this will become a long term reliability issue . The data discussed above show that both the ...
Page 285
... delaminate , but also the deformation process prior to delamination . We examined this problem further by comparing a finite element model in which the interface was assumed to have no effect on experimental results and looking at how ...
... delaminate , but also the deformation process prior to delamination . We examined this problem further by comparing a finite element model in which the interface was assumed to have no effect on experimental results and looking at how ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch