Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 39
... density . Silanol concentration was determined by a method described elsewhere . Film density was determined from measurement of film mass and thickness using an average of three wafers . Density of thermal oxide using this technique ...
... density . Silanol concentration was determined by a method described elsewhere . Film density was determined from measurement of film mass and thickness using an average of three wafers . Density of thermal oxide using this technique ...
Page 40
... density on dielectric constant is modeled for hydrogen silsesquioxane with a two phase system of silica and air using a parallel capacitance model . Samples cured to high normalized SiH bond density without oxidation are approximated ...
... density on dielectric constant is modeled for hydrogen silsesquioxane with a two phase system of silica and air using a parallel capacitance model . Samples cured to high normalized SiH bond density without oxidation are approximated ...
Page 43
... Density , % 25 25 500 75 100 8 0 350 0.5 400 450 Temperature , ° C ( a ) 1.5 Time , Hr . Film Density , g / cc 1.8 1.7 1.6 . 1.5 1.4 1.3 . 1.2 450 0.5 400 350 Temperature , ° C ( b ) Figure 7. Effect of cure process time and temperature ...
... Density , % 25 25 500 75 100 8 0 350 0.5 400 450 Temperature , ° C ( a ) 1.5 Time , Hr . Film Density , g / cc 1.8 1.7 1.6 . 1.5 1.4 1.3 . 1.2 450 0.5 400 350 Temperature , ° C ( b ) Figure 7. Effect of cure process time and temperature ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch