Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 12
Page 99
... dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano - structures and densities . INTRODUCTION Silica aerogels are intrinsically low dielectric constant materials ...
... dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano - structures and densities . INTRODUCTION Silica aerogels are intrinsically low dielectric constant materials ...
Page 103
... dependence data for the dielectric constant of silica aerogels is plotted in Fig.4 . We obtain a linear least squares fit to the data from which we measure a slope , 61.7 K. Using this value , we get the value of 41.8 debye units , for ...
... dependence data for the dielectric constant of silica aerogels is plotted in Fig.4 . We obtain a linear least squares fit to the data from which we measure a slope , 61.7 K. Using this value , we get the value of 41.8 debye units , for ...
Page 213
... dependence on the deposition conditions . The films deposited at a low vaporizer temperature exhibit a smooth surface ( RMS ~ 4 nm ) while those deposited at high vaporizer temperature have a rougher surface ( RMS ~ 16 nm ) . However ...
... dependence on the deposition conditions . The films deposited at a low vaporizer temperature exhibit a smooth surface ( RMS ~ 4 nm ) while those deposited at high vaporizer temperature have a rougher surface ( RMS ~ 16 nm ) . However ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch