Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 17
Page 99
TEMPERATURE AND MOISTURE DEPENDENCE OF DIELECTRIC CONSTANT FOR BULK SILICA AEROGELS * L.W. HRUBESH and S. R. Buckley , Chemistry & Materials Science Department , Lawrence Livermore National Laboratory , Livermore , CA 94550 hrubesh1 ...
TEMPERATURE AND MOISTURE DEPENDENCE OF DIELECTRIC CONSTANT FOR BULK SILICA AEROGELS * L.W. HRUBESH and S. R. Buckley , Chemistry & Materials Science Department , Lawrence Livermore National Laboratory , Livermore , CA 94550 hrubesh1 ...
Page 102
Of these , only the orientational polarization ( ie . , the contribution of the permanent dipoles in the material ) is directly temperature dependent . For gas - like behavior , this dependence can be seen from the molar polarization or ...
Of these , only the orientational polarization ( ie . , the contribution of the permanent dipoles in the material ) is directly temperature dependent . For gas - like behavior , this dependence can be seen from the molar polarization or ...
Page 103
The temperature dependence data for the dielectric constant of silica aerogels is plotted in Fig . 4. We obtain a linear least squares fit to the data from which we measure a slope , 61.7 K. Using this value , we get the value of 41.8 ...
The temperature dependence data for the dielectric constant of silica aerogels is plotted in Fig . 4. We obtain a linear least squares fit to the data from which we measure a slope , 61.7 K. Using this value , we get the value of 41.8 ...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
33 other sections not shown
Other editions - View all
Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer
Bibliographic information
| Title | Low-dielectric Constant Materials, Volume 476 Volume 381; Volume 443; Volume 476; Volume 511; Volume 565 of Materials Research Society symposia proceedings |
| Publisher | Materials Research Society, 1997 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558993800, 9781558993808 |
| Export Citation | BiBTeX EndNote RefMan |