Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 11
Page 72
... Depth ( micron ) ( b ) CONDITION B Fig.5 Fluorine depth profile for as SiOF deposition samples . On the other hand , Figure 6 ( a ) and 6 ( b ) show SIMS analysis data for the W / TIN / SiO2 / SiOF / BPSG / TiSi2 stacked films where ...
... Depth ( micron ) ( b ) CONDITION B Fig.5 Fluorine depth profile for as SiOF deposition samples . On the other hand , Figure 6 ( a ) and 6 ( b ) show SIMS analysis data for the W / TIN / SiO2 / SiOF / BPSG / TiSi2 stacked films where ...
Page 73
... Depth ( micron ) ( b ) CONDITION B Depth ( micron ) ( a ) CONDITION A Fig.6 Fluorine depth profiles for after metal formation samples Figure 7 ( a ) and 7 ( b ) show TDS spectra of the W / TiN / SiO2 / SiOF / BPSG / TiSi2 stacked films ...
... Depth ( micron ) ( b ) CONDITION B Depth ( micron ) ( a ) CONDITION A Fig.6 Fluorine depth profiles for after metal formation samples Figure 7 ( a ) and 7 ( b ) show TDS spectra of the W / TiN / SiO2 / SiOF / BPSG / TiSi2 stacked films ...
Page 258
... depth resolution of nm and force resolution of mN have recently become commercially available and suitable to thin films . Hardness and elastic modulus measurements were obtained from thin films of hard oxides to soft polymer coatings ...
... depth resolution of nm and force resolution of mN have recently become commercially available and suitable to thin films . Hardness and elastic modulus measurements were obtained from thin films of hard oxides to soft polymer coatings ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch