Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 39
... determine normalized SiH bond density . Silanol concentration was determined by a method described elsewhere . Film density was determined from measurement of film mass and thickness using an average of three wafers . Density of thermal ...
... determine normalized SiH bond density . Silanol concentration was determined by a method described elsewhere . Film density was determined from measurement of film mass and thickness using an average of three wafers . Density of thermal ...
Page 141
... determined . To address this issue , films were elongated under a polarized microscope to determine the onset of cracking and / or delamination . Below 2 % elongation no change in the film's appearance was observed . Above 2 % , cracks ...
... determined . To address this issue , films were elongated under a polarized microscope to determine the onset of cracking and / or delamination . Below 2 % elongation no change in the film's appearance was observed . Above 2 % , cracks ...
Page 257
... determined at an accuracy of ± 0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be able to ... determined to be 520 ° C . The onset glass transition temperature ( Tg ) , determined from both DTA and TMA analysis ...
... determined at an accuracy of ± 0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be able to ... determined to be 520 ° C . The onset glass transition temperature ( Tg ) , determined from both DTA and TMA analysis ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch