Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 74
... Devices and Materials , Osaka , 1995 , pp605-607 . 7. N.Hayasaka , H.Miyajima , Y.Nakasaki and R.Katsumata Extended Abstracts of International Conference on Solid State Devices and Materials , Osaka , 1995 , pp157-159 . 8. W.Li , K ...
... Devices and Materials , Osaka , 1995 , pp605-607 . 7. N.Hayasaka , H.Miyajima , Y.Nakasaki and R.Katsumata Extended Abstracts of International Conference on Solid State Devices and Materials , Osaka , 1995 , pp157-159 . 8. W.Li , K ...
Page 87
... devices may require materials with dielectric constants approaching 2.0 . While there are a number of possible candidates for current uses , the list of usable materials with dielectric constants < 3.0 is very limited . Future low K ...
... devices may require materials with dielectric constants approaching 2.0 . While there are a number of possible candidates for current uses , the list of usable materials with dielectric constants < 3.0 is very limited . Future low K ...
Page 261
... devices was performed before and after the thermal stability test . Although the device performance did not change greatly , the reaction certainly affects the long term device reliability ( vide infra ) . Barrier materials were ...
... devices was performed before and after the thermal stability test . Although the device performance did not change greatly , the reaction certainly affects the long term device reliability ( vide infra ) . Barrier materials were ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch