Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 81
... dianhydride oxdianiline ) polyimide type 2540 ( DuPont TM M ) was spun on to a Si ( 100 ) wafer then cured by following industrial fabrication conditions . Ultra - high- vacuum DC magnetron sputtering apparatus ( base pressure < 2x10-6 ...
... dianhydride oxdianiline ) polyimide type 2540 ( DuPont TM M ) was spun on to a Si ( 100 ) wafer then cured by following industrial fabrication conditions . Ultra - high- vacuum DC magnetron sputtering apparatus ( base pressure < 2x10-6 ...
Page 93
dianhydride . The resulting poly ( amic acid ) solutions were then cast and heated to give thin films , or in the case of the soluble polyimides , chemically imidized in solution and subsequently isolated by precipitation . Depending ...
dianhydride . The resulting poly ( amic acid ) solutions were then cast and heated to give thin films , or in the case of the soluble polyimides , chemically imidized in solution and subsequently isolated by precipitation . Depending ...
Page 253
... dianhydride reacting with bis- ( methoxyethyl ) amine and methanol gave after work - up in the next step ( ii ) , the pure p - bis- imidazolide according to 3C NMR spectrum . Bis - imidazolide diamide and bis - imidazolide diester were ...
... dianhydride reacting with bis- ( methoxyethyl ) amine and methanol gave after work - up in the next step ( ii ) , the pure p - bis- imidazolide according to 3C NMR spectrum . Bis - imidazolide diamide and bis - imidazolide diester were ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch