Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 87
Page 51
No one material satisfies all the requirements for multilevel interconnections ,
which include low dielectric constant , high mechanical strength , good
dimensional stability , good high temperature stability , easy processing , and low
H2O ...
No one material satisfies all the requirements for multilevel interconnections ,
which include low dielectric constant , high mechanical strength , good
dimensional stability , good high temperature stability , easy processing , and low
H2O ...
Page 99
TEMPERATURE AND MOISTURE DEPENDENCE OF DIELECTRIC CONSTANT
FOR BULK SILICA AEROGELS * L . W . HRUBESH and S . R . Buckley ,
Chemistry & Materials Science Department , Lawrence Livermore National
Laboratory ...
TEMPERATURE AND MOISTURE DEPENDENCE OF DIELECTRIC CONSTANT
FOR BULK SILICA AEROGELS * L . W . HRUBESH and S . R . Buckley ,
Chemistry & Materials Science Department , Lawrence Livermore National
Laboratory ...
Page 129
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF
FLUORINATED POLYIMIDE ALVIN L . S . LOKE , JEFFREY T . WETZELF , JOHN
J . STANKUSĖ , S . SIMON WONG Center for Integrated Systems , Stanford ...
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF
FLUORINATED POLYIMIDE ALVIN L . S . LOKE , JEFFREY T . WETZELF , JOHN
J . STANKUSĖ , S . SIMON WONG Center for Integrated Systems , Stanford ...
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Contents
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
INTERFACES AND POROUS MATERIALS | 59 |
Copyright | |
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Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode moisture observed obtained occurs oxide oxygen PA-N passivation peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer