Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 78
Page 31
... dielectric constant values around 2.0 . The behavior of these films when ... dielectric constant , and infrared absorption spectrum change with the F : H ratio ... film properties . In this study , the dielectric constant of the films is ...
... dielectric constant values around 2.0 . The behavior of these films when ... dielectric constant , and infrared absorption spectrum change with the F : H ratio ... film properties . In this study , the dielectric constant of the films is ...
Page 121
... dielectric coatings . Spin - coated films of this poly ( arylene ether ) ... Dielectric constants of e - beam cured films and thermally cured films are nearly ... film an excellent candidate for interlevel dielectric integration processes ...
... dielectric coatings . Spin - coated films of this poly ( arylene ether ) ... Dielectric constants of e - beam cured films and thermally cured films are nearly ... film an excellent candidate for interlevel dielectric integration processes ...
Page 147
... dielectric breakdown is also studied for the same film . It is observed that the dielectric strength of the film decreases at first and then increases above 4 MPa of compressive stress . INTRODUCTION 2,3 Polymeric films have become ...
... dielectric breakdown is also studied for the same film . It is observed that the dielectric strength of the film decreases at first and then increases above 4 MPa of compressive stress . INTRODUCTION 2,3 Polymeric films have become ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch