Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 16
Page 265
... diffusion from the FSG films at elevated temperatures . In order to solve the problem , one can either make a more stable FSG film or put in effective diffusion barriers to prevent F from diffusing to the metals or to the transistors ...
... diffusion from the FSG films at elevated temperatures . In order to solve the problem , one can either make a more stable FSG film or put in effective diffusion barriers to prevent F from diffusing to the metals or to the transistors ...
Page 266
... diffusion into the oxide was detected . Device reliability tests indicate that without appropriate diffusion barriers , metal blistering and TiSi2 delamination will occur . SIMS data showed that PECVD silicon nitride is a better diffusion ...
... diffusion into the oxide was detected . Device reliability tests indicate that without appropriate diffusion barriers , metal blistering and TiSi2 delamination will occur . SIMS data showed that PECVD silicon nitride is a better diffusion ...
Page 272
... diffusion barrier than Ti against fluorine penetration . The diffusion of Ti from TiN into SiOF may have effectively reduced the activity and mobility of fluorine . Conversely the Ti in sample e may have been consumed by ( Al ) to form ...
... diffusion barrier than Ti against fluorine penetration . The diffusion of Ti from TiN into SiOF may have effectively reduced the activity and mobility of fluorine . Conversely the Ti in sample e may have been consumed by ( Al ) to form ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch