Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 121
... beam ( e - beam ) exposure on the chemical and physical properties of FLARE TM 1.0X , a non - fluorinated member of ... cured by large - area e - beam exposure , as well as by conventional thermal processing . Neither swelling nor ...
... beam ( e - beam ) exposure on the chemical and physical properties of FLARE TM 1.0X , a non - fluorinated member of ... cured by large - area e - beam exposure , as well as by conventional thermal processing . Neither swelling nor ...
Page 124
... cured and e - beam cured films are summarized in Table 2. Compared to the thermal cure , the e - beam cure leads to a higher refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase ...
... cured and e - beam cured films are summarized in Table 2. Compared to the thermal cure , the e - beam cure leads to a higher refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase ...
Page 125
... e - beam cured films ; and ( b ) : thermal cure and high dose e - beam cured films . Solvent Resistance Table 3 shows the thickness retention ( % ) for films after immersion in N - methylpyrrolidone ( NMP ) at 90 ° C for one hour . A ...
... e - beam cured films ; and ( b ) : thermal cure and high dose e - beam cured films . Solvent Resistance Table 3 shows the thickness retention ( % ) for films after immersion in N - methylpyrrolidone ( NMP ) at 90 ° C for one hour . A ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch