Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 64
Page 33
... effect of the gas mixture on the dielectric constant and the tan 8. As the amount of fluorine injected declines , the dielectric constant rises , while tan 8 appears scattered . The mean of the tan 8 values for these films is about ...
... effect of the gas mixture on the dielectric constant and the tan 8. As the amount of fluorine injected declines , the dielectric constant rises , while tan 8 appears scattered . The mean of the tan 8 values for these films is about ...
Page 99
... effect of sorbed molecules on the dielectric properties of silica aerogels , and one paper [ 3 ] reports the effect of sorbed water on the dielectric constant for low frequencies ( < 107Hz ) . However , no results have been given ...
... effect of sorbed molecules on the dielectric properties of silica aerogels , and one paper [ 3 ] reports the effect of sorbed water on the dielectric constant for low frequencies ( < 107Hz ) . However , no results have been given ...
Page 283
... effect is masked by the stronger effect of fluorine content . Side- wall wet etch rates were generally higher than top surface etch rates , for both undoped oxide and lightly doped FSG , indicating that the stress is less compressive on ...
... effect is masked by the stronger effect of fluorine content . Side- wall wet etch rates were generally higher than top surface etch rates , for both undoped oxide and lightly doped FSG , indicating that the stress is less compressive on ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch