Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 129
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF FLUORINATED POLYIMIDE ALVIN L.S. LOKE * , JEFFREY T. WETZEL , JOHN J. STANKUS , S. SIMON WONG * * Center for Integrated Systems , Stanford University , CIS 017 MC 4070 ...
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF FLUORINATED POLYIMIDE ALVIN L.S. LOKE * , JEFFREY T. WETZEL , JOHN J. STANKUS , S. SIMON WONG * * Center for Integrated Systems , Stanford University , CIS 017 MC 4070 ...
Page 133
... electrical technique to extract the. I Normalized Equipotentials 0.0 0.5 air nitride FPI - 136M fluorinated polyimide ... Electric Field ( b ) Figure 6. Simulated ( a ) potential contours for poly- I imide passivation and ( b ) electric ...
... electrical technique to extract the. I Normalized Equipotentials 0.0 0.5 air nitride FPI - 136M fluorinated polyimide ... Electric Field ( b ) Figure 6. Simulated ( a ) potential contours for poly- I imide passivation and ( b ) electric ...
Page 152
... Electric Field 0 0.0 10 20 30 40 50 Time ( s ) 0 0 1 2 3 4 5 Pressure ( MPa ) Figure 1 : Breakdown voltage under ... Electrical Insulation , 1 , [ 5 ] , 904 , ( 1994 ) . 5. M. Hudis and D. Howe , Motor Run Capacitors , Aerovox Group ...
... Electric Field 0 0.0 10 20 30 40 50 Time ( s ) 0 0 1 2 3 4 5 Pressure ( MPa ) Figure 1 : Breakdown voltage under ... Electrical Insulation , 1 , [ 5 ] , 904 , ( 1994 ) . 5. M. Hudis and D. Howe , Motor Run Capacitors , Aerovox Group ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch