Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 121
... Electron Vision , 9919 Via Pasar , San Diego , CA 92126 ABSTRACT This paper presents a study of the effects of electron beam ( e - beam ) exposure on the chemical and physical properties of FLARE TM 1.0X , a non - fluorinated member of ...
... Electron Vision , 9919 Via Pasar , San Diego , CA 92126 ABSTRACT This paper presents a study of the effects of electron beam ( e - beam ) exposure on the chemical and physical properties of FLARE TM 1.0X , a non - fluorinated member of ...
Page 122
... Electron beam curing is capable of improving both chemical and physical properties of the film compared to ... Electron beam exposure was conducted in a chamber incorporating a large area electron source and quartz lamps for heating the ...
... Electron beam curing is capable of improving both chemical and physical properties of the film compared to ... Electron beam exposure was conducted in a chamber incorporating a large area electron source and quartz lamps for heating the ...
Page 260
... Electron Devices Meeting , 1995 , p . 241 . [ 3 ] K.L. Mittal , Polyimides : Synthesis , Characterization and Applications , I and II , Plenum Press , New York , 1984 . [ 4 ] K. Moriya , T. Ohsaki , and K. Katsura , Electron Components ...
... Electron Devices Meeting , 1995 , p . 241 . [ 3 ] K.L. Mittal , Polyimides : Synthesis , Characterization and Applications , I and II , Plenum Press , New York , 1984 . [ 4 ] K. Moriya , T. Ohsaki , and K. Katsura , Electron Components ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch