Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 17
Page 161
... Engineering *** Department of Materials Science and Engineering ABSTRACT The quality of benzocyclobutene ( BCB ) and Parylene - N ( PA - N ) films after chemical - mechanical polishing ( CMP ) is influenced by 3 factors : slurry ...
... Engineering *** Department of Materials Science and Engineering ABSTRACT The quality of benzocyclobutene ( BCB ) and Parylene - N ( PA - N ) films after chemical - mechanical polishing ( CMP ) is influenced by 3 factors : slurry ...
Page 207
... Engineering and Material Science and Engineering Program , Clemson , SC 29634-0915 . ABSTRACT The development of materials with dielectric constant ( K ) less than SiO2 ( K = 3.9 ) is essential to meet the stringent speed , power ...
... Engineering and Material Science and Engineering Program , Clemson , SC 29634-0915 . ABSTRACT The development of materials with dielectric constant ( K ) less than SiO2 ( K = 3.9 ) is essential to meet the stringent speed , power ...
Page 273
... Engineering , and Materials Science and Engineering , North Carolina State University , Raleigh , NC 27695 ABSTRACT There is considerable interest in insulators with static dielectric constants lower than SiO2 ; an alloy system ...
... Engineering , and Materials Science and Engineering , North Carolina State University , Raleigh , NC 27695 ABSTRACT There is considerable interest in insulators with static dielectric constants lower than SiO2 ; an alloy system ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch