Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 48
... etch process . The ratio of etch rates is plotted in Fig . 5 as etch selectivity of SOG - T11 and SOP - 418 with respect to TEOS as a function of CF4 / CHF3 flow ratio showing a large off - set for the two curves . In addition , the ...
... etch process . The ratio of etch rates is plotted in Fig . 5 as etch selectivity of SOG - T11 and SOP - 418 with respect to TEOS as a function of CF4 / CHF3 flow ratio showing a large off - set for the two curves . In addition , the ...
Page 280
Film Stress ( MPa ) Etch rates on blanket films were determined from the film thickness before and after a 60 sec- ond dip in 6 : 1 buffered oxide etch solution . Etch rates on patterned wafers were measured by comparing SEM photographs ...
Film Stress ( MPa ) Etch rates on blanket films were determined from the film thickness before and after a 60 sec- ond dip in 6 : 1 buffered oxide etch solution . Etch rates on patterned wafers were measured by comparing SEM photographs ...
Page 281
Wet Etch Rate ( Å / min . ) Wet etch rates of these films were expected to depend on both refractive index ( fluorine content ) and stress . Figure 2 shows that the wet etch rates of undoped TEOS oxide films increase as the stress is ...
Wet Etch Rate ( Å / min . ) Wet etch rates of these films were expected to depend on both refractive index ( fluorine content ) and stress . Figure 2 shows that the wet etch rates of undoped TEOS oxide films increase as the stress is ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch