Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 11
Page 105
... evaporation . This investigation is performed in an effort to assess the viability of organically modified silica . xerogels as on - chip dielectric materials . In this study , the replacement of certain oxygen atoms by methyl groups in ...
... evaporation . This investigation is performed in an effort to assess the viability of organically modified silica . xerogels as on - chip dielectric materials . In this study , the replacement of certain oxygen atoms by methyl groups in ...
Page 198
... evaporate into the gas phase . Materials needing sophisticated bubbler or liquid delivery systems were removed from consideration , as were materials which needed further preparation like a subsequent heat ... evaporation temperatures 198.
... evaporate into the gas phase . Materials needing sophisticated bubbler or liquid delivery systems were removed from consideration , as were materials which needed further preparation like a subsequent heat ... evaporation temperatures 198.
Page 232
... evaporate . The wafers were then passed onto a hot plate set at a temperature of 130 ° C with direct contact for 60 seconds to allow curing of the silane . Hexamethyldisilazane ( HMDS ) was applied to 2 wafers using a standard vapor ...
... evaporate . The wafers were then passed onto a hot plate set at a temperature of 130 ° C with direct contact for 60 seconds to allow curing of the silane . Hexamethyldisilazane ( HMDS ) was applied to 2 wafers using a standard vapor ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch