Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 12
Page 99
... exhibit low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large surface areas for aerogels , their dielectric constants are strongly affected by moisture and ...
... exhibit low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large surface areas for aerogels , their dielectric constants are strongly affected by moisture and ...
Page 118
... exhibit a high degree of anisotropy in both optical and dielectric constants as evidenced by the refractive index birefringence from Table I. The lack of dielectric constant anisotropy between the 2 measurements may suggest that ...
... exhibit a high degree of anisotropy in both optical and dielectric constants as evidenced by the refractive index birefringence from Table I. The lack of dielectric constant anisotropy between the 2 measurements may suggest that ...
Page 260
... exhibit optical anisotropy with the average in - plane refractive index of 1.74 and the out - of - plane index of 1.62 , indicating a strong preference of polymer chains to orient along the film plane . The dielectric constants were 3.0 ...
... exhibit optical anisotropy with the average in - plane refractive index of 1.74 and the out - of - plane index of 1.62 , indicating a strong preference of polymer chains to orient along the film plane . The dielectric constants were 3.0 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch