Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 57
Page 109
... experiment is seen in Figure 5 . Electric Field ( MV / cm ) Current ( A ) 1.6 2,1 1.00E - 03 1.00E - 05 1.00E - 07 2,6 3.1 3.6 1.00E - 09 Figure 5. The voltage breakdown test for a cured film , 1.25 μm in thickness ... experiments 109.
... experiment is seen in Figure 5 . Electric Field ( MV / cm ) Current ( A ) 1.6 2,1 1.00E - 03 1.00E - 05 1.00E - 07 2,6 3.1 3.6 1.00E - 09 Figure 5. The voltage breakdown test for a cured film , 1.25 μm in thickness ... experiments 109.
Page 122
... experiments were performed using a Tencor Flexus stress measurement system . Stress - temperature cycling experiments were conducted from room temperature to 500 ° C ; during the heating phase the temperature was raised 4 ° C per minute ...
... experiments were performed using a Tencor Flexus stress measurement system . Stress - temperature cycling experiments were conducted from room temperature to 500 ° C ; during the heating phase the temperature was raised 4 ° C per minute ...
Page 262
... experiment are listed in table 1. The Ti , TiN , and Al were PVD deposited films . The TiSi2 films were formed on the ... experiments were designed ( see table 2 ) . In Experiment 1 , the splits were designed to understand the impact of ...
... experiment are listed in table 1. The Ti , TiN , and Al were PVD deposited films . The TiSi2 films were formed on the ... experiments were designed ( see table 2 ) . In Experiment 1 , the splits were designed to understand the impact of ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch