Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 26
Page 113
... fluorinated polyimides for interlayer dielectric applications . Evolution of ... polyimide single - level metal structures have been used to characterize ... polyimide has been to incorporate fluorine into the polyimide molecule . Other ...
... fluorinated polyimides for interlayer dielectric applications . Evolution of ... polyimide single - level metal structures have been used to characterize ... polyimide has been to incorporate fluorine into the polyimide molecule . Other ...
Page 114
... fluorinated BPDA - PPD and fluorinated FPI Thin Film Material Properties In - plane refractive index , nTE Out - of ... polyimide molecule , its high molecular weight and high solvent content ( 85-90 wt % ) of the starting polyimide ...
... fluorinated BPDA - PPD and fluorinated FPI Thin Film Material Properties In - plane refractive index , nTE Out - of ... polyimide molecule , its high molecular weight and high solvent content ( 85-90 wt % ) of the starting polyimide ...
Page 116
... fluorinated polyimide prepared from pure NMP solvent to those prepared with additive systems 1 and 2. Most notably , formulations containing gap fill additives have higher dielectric constant and significantly reduced elongation - at ...
... fluorinated polyimide prepared from pure NMP solvent to those prepared with additive systems 1 and 2. Most notably , formulations containing gap fill additives have higher dielectric constant and significantly reduced elongation - at ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch