Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 186
... fluoropolymer films can be made variable [ 3 ] . PLASMA DEPOSITED FLUOROPOLYMER FILMS AS NOVEL MATERIALS A good point to start with is to show why plasma deposited fluoropolymers really are to be considered an entirely novel class of ...
... fluoropolymer films can be made variable [ 3 ] . PLASMA DEPOSITED FLUOROPOLYMER FILMS AS NOVEL MATERIALS A good point to start with is to show why plasma deposited fluoropolymers really are to be considered an entirely novel class of ...
Page 188
... fluoropolymer . In figure 3 it is shown that the critical surface tension of PE - CVD films obtained from C2F6-20 % H2 . is coincident with Teflon ( 18 dynes / cm ) , while for other mixtures quite different values are obtained . Figure ...
... fluoropolymer . In figure 3 it is shown that the critical surface tension of PE - CVD films obtained from C2F6-20 % H2 . is coincident with Teflon ( 18 dynes / cm ) , while for other mixtures quite different values are obtained . Figure ...
Page 207
... fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra violet ( UV ) light source in a computerized rapid isothermal processing ( RIP ) sys- tem ...
... fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra violet ( UV ) light source in a computerized rapid isothermal processing ( RIP ) sys- tem ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch